A comprehensive methodology for criticality assessment of microvias in printed circuit board assemblies

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

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A comprehensive methodology for criticality assessment of microvias in printed circuit board assemblies. / Kamble, Vikram G.; Patel, Dhaval Rasheshkumar; Schipfer, Christian et al.
2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024. Institute of Electrical and Electronics Engineers, 2024. (2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Harvard

Kamble, VG, Patel, DR, Schipfer, C, Thalhamer, A, Zuendel, J, Krivec, T, Antretter, T & Fuchs, PF 2024, A comprehensive methodology for criticality assessment of microvias in printed circuit board assemblies. in 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024. 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024, Institute of Electrical and Electronics Engineers, 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024, Catania, Italy, 7/04/24. https://doi.org/10.1109/EuroSimE60745.2024.10491487

APA

Kamble, V. G., Patel, D. R., Schipfer, C., Thalhamer, A., Zuendel, J., Krivec, T., Antretter, T., & Fuchs, P. F. (2024). A comprehensive methodology for criticality assessment of microvias in printed circuit board assemblies. In 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024 (2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024). Institute of Electrical and Electronics Engineers. https://doi.org/10.1109/EuroSimE60745.2024.10491487

Vancouver

Kamble VG, Patel DR, Schipfer C, Thalhamer A, Zuendel J, Krivec T et al. A comprehensive methodology for criticality assessment of microvias in printed circuit board assemblies. In 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024. Institute of Electrical and Electronics Engineers. 2024. (2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024). doi: 10.1109/EuroSimE60745.2024.10491487

Author

Kamble, Vikram G. ; Patel, Dhaval Rasheshkumar ; Schipfer, Christian et al. / A comprehensive methodology for criticality assessment of microvias in printed circuit board assemblies. 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024. Institute of Electrical and Electronics Engineers, 2024. (2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024).

Bibtex - Download

@inproceedings{4ec9c7a67d6642099e3b5550dd8c168c,
title = "A comprehensive methodology for criticality assessment of microvias in printed circuit board assemblies",
keywords = "Criticality Assessment, Finite Element Analysis (FEA), Microelectronics, Microvia, Printed Circuit Board Assembly (PCBA), Reliability, Via",
author = "Kamble, {Vikram G.} and Patel, {Dhaval Rasheshkumar} and Christian Schipfer and Andreas Thalhamer and Julia Zuendel and Thomas Krivec and Thomas Antretter and Fuchs, {Peter Filipp}",
note = "Publisher Copyright: {\textcopyright} 2024 IEEE.; 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024 ; Conference date: 07-04-2024 Through 10-04-2024",
year = "2024",
doi = "10.1109/EuroSimE60745.2024.10491487",
language = "English",
series = "2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024",
publisher = "Institute of Electrical and Electronics Engineers",
booktitle = "2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024",
address = "United States",

}

RIS (suitable for import to EndNote) - Download

TY - GEN

T1 - A comprehensive methodology for criticality assessment of microvias in printed circuit board assemblies

AU - Kamble, Vikram G.

AU - Patel, Dhaval Rasheshkumar

AU - Schipfer, Christian

AU - Thalhamer, Andreas

AU - Zuendel, Julia

AU - Krivec, Thomas

AU - Antretter, Thomas

AU - Fuchs, Peter Filipp

N1 - Publisher Copyright: © 2024 IEEE.

PY - 2024

Y1 - 2024

KW - Criticality Assessment

KW - Finite Element Analysis (FEA)

KW - Microelectronics

KW - Microvia

KW - Printed Circuit Board Assembly (PCBA)

KW - Reliability

KW - Via

UR - http://www.scopus.com/inward/record.url?scp=85191163013&partnerID=8YFLogxK

U2 - 10.1109/EuroSimE60745.2024.10491487

DO - 10.1109/EuroSimE60745.2024.10491487

M3 - Conference contribution

AN - SCOPUS:85191163013

T3 - 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024

BT - 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024

PB - Institute of Electrical and Electronics Engineers

T2 - 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024

Y2 - 7 April 2024 through 10 April 2024

ER -

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