Simon Doppermann
(Former)
Activities
Combining high strength, ductility and toughness in interface-doped W-Cu nanocomposites
Kiener, D. (Invited speaker), Wurmshuber, M. (Speaker), Doppermann, S. (contributor), Alfreider, M. (contributor), Issa, I. (contributor), Schmuck, K. S. (contributor), Burtscher, M. (contributor), Wurster, S. (contributor), Jakob, S. (contributor), Bodlos, R. (contributor), Romaner, L. (contributor), Gammer, C. (contributor), Maier-Kiener, V. (contributor) & Clemens, H. (contributor)
29 Nov 2021Activity: Talk or presentation › Oral presentation
