Raul Bermejo

Research output

  1. 2016
  2. Published

    Assessment of crack-related problems in layered ceramics using the finite fracture mechanics and coupled stress-energy criterion

    Ševeček, O., Kotoul, M., Leguillon, D., Martin, E. & Bermejo, R., 1 Jan 2016, In: Procedia Structural Integrity. 2, p. 2014-2021 8 p.

    Research output: Contribution to journalArticleResearchpeer-review

  3. Published

    Effects of subcritical crack growth on the determination of fracture toughness in brittle materials

    Krautgasser, C., Chlup, Z., Supancic, P., Danzer, R. & Bermejo, R., 2016, In: Journal of the European Ceramic Society. 36, p. 1307-1312 6 p.

    Research output: Contribution to journalArticleResearchpeer-review

  4. Published
  5. Published

    Mechanical properties of tape casted Lanthanum Tungstate for membrane substrate application

    Stournari, V., Deibert, W., Ivanov, M. E., Krautgasser, C., Bermejo, R. & Malzbender, J., 2016, In: Ceramics International : CI. 42, 14, p. 15177-15182 6 p.

    Research output: Contribution to journalArticleResearchpeer-review

  6. Published

    Modelling of edge crack formation and propagation in ceramic laminates using the stress-energy coupled criterion

    Sevecek, O., Kotoul, M., Leguillon, D. P., Martin, E. & Bermejo, R., 2016, In: Engineering Fracture Mechanics. 167, p. 45–55

    Research output: Contribution to journalArticleResearchpeer-review

  7. Published

    Residual lifetime determination of low temperature co-fired ceramics

    Majer, Z., Štegnerová, K., Hutar, P., Pletz, M., Bermejo, R. & Náhlík, L., 2016, Advances in Fracture and Damage Mechanics XV. Trans Tech Publications, Vol. 713. p. 266-269 4 p. (Key Engineering Materials; vol. 713).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  8. Published
  9. 2015
  10. Published
  11. Published
  12. Published

    Comparison of Different Methods for Stress and Deflection Analysis in Embedded die Packages during the Assembly Process

    Macurova, K., Bermejo, R., Pletz, M., Schöngrundner, R., Antretter, T., Krivec, T., Morianz, M., Brizoux, M. & Lecavelier, A., 1 Apr 2015, In: Journal of Microelectronics and Electronic Packaging. 12.2015, 2, p. 80-85 6 p.

    Research output: Contribution to journalArticleResearchpeer-review

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