Michael Meindlhumer
Research output
- 2024
- Published
Nanoscale stress and microstructure gradients across a buckled Mo-Cu bilayer: Cu self-annealing triggered by interface delamination
Lassnig, A., Todt, J., Tkadletz, M., Žák, S., Mitterer, C., Medjahed, A. A., Burghammer, M., Keckes, J., Cordill, M. J. & Meindlhumer, M., 15 Oct 2024, In: Acta Materialia. 2025, 283, 15 p., 120465.Research output: Contribution to journal › Article › Research › peer-review
- Published
Backside metallization affects residual stress and bending strength of the recast layer in laser-diced Si
Ziegelwanger, T., Reisinger, M., Matoy, K., Medjahed, A. A., Zalesak, J., Gruber, M., Meindlhumer, M. & Keckes, J., Oct 2024, In: Materials Science in Semiconductor Processing. 181, 108579.Research output: Contribution to journal › Article › Research › peer-review
- Published
Multimethod cross-sectional characterization approaching the limits of diamond monophase multilayers
Meindlhumer, M., Grau, J., Sternschulte, H., Halahovets, Y., Siffalovic, P., Burghammer, M., Steinmüller-Nethl, D. & Keckes, J., 13 May 2024, In: Materials characterization. 2024, 212, 15 p., 113973.Research output: Contribution to journal › Article › Research › peer-review
- Published
Toughness enhancement in TiN/Zr0.37Al0.63N1.09 multilayer films
Lorentzon, M., Meindlhumer, M., Palisaitis, J., Greczynski, G., Keckes, J., Rosen, J., Hultman, L., Birch, J. & Ghafoor, N., 4 May 2024, In: Acta Materialia. 2024, 273, 14 p., 119979.Research output: Contribution to journal › Article › Research › peer-review
- Published
Hardness and fracture toughness enhancement in transition metal diboride multilayer films with structural variations
Vidis, M., Fiantok, T., Gocnik, M., Svec, P. J., Nagy, S., Truchly, M., Izai, V., Roch, T., Satrapinskyy, L., Sroba, V., Meindlhumer, M., Grancic, B., Kus, P., Keckes, J. & Mikula, M., 21 Mar 2024, In: Materialia. 2024, 34, 11 p., 102070.Research output: Contribution to journal › Article › Research › peer-review
- Published
Micromechanical Properties of Micro- and Nanocrystalline CVD Diamond Thin Films with Gradient Microstructures and Stresses
Meindlhumer, M., Ziegelwanger, T., Grau, J., Sternschulte, H., Sztucki, M., Steinmüller-Nethl, D. & Keckes, J., 12 Jan 2024, In: Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films. 2024, 42, 12 p., 023401.Research output: Contribution to journal › Article › Research › peer-review
- Published
Revealing dynamic-mechanical properties of precipitates in a nanostructured thin film using micromechanical spectroscopy
Alfreider, M., Meindlhumer, M., Ziegelwanger, T., Daniel, R., Keckes, J. & Kiener, D., 2024, In: MRS Bulletin. 2024, 49, p. 49-58Research output: Contribution to journal › Article › Research › peer-review
- 2023
- Published
Intragranular thermal fatigue of Cu thin films: Near-grain boundary hardening, strain localization and voiding
Hlushko, K., Ziegelwanger, T., Reisinger, M., Todt, J., Meindlhumer, M., Beuer, S., Rommel, M., Greving, I., Flenner, S., Kopecek, J., Keckes, J., Detlefs, C. & Yildirim, C., 1 Jul 2023, In: Acta Materialia. 253.2023, 1 July, 10 p., 118961.Research output: Contribution to journal › Article › Research › peer-review
- Published
Local gradients of microstructure and residual stresses in Si device sidewalls separated by laser dicing
Ziegelwanger, T., Meindlhumer, M., Todt, J., Reisinger, M., Matoy, K. & Keckes, J., 24 Apr 2023.Research output: Contribution to conference › Poster › Research
- Published
Microstructural characterization and mechanical properties of nanocomposite AlCrSiN thin films
Kutlesa, K., Meindlhumer, M. & Keckes, J., 2023.Research output: Contribution to conference › Poster › Research