Michael Meindlhumer

Research output

  1. 2024
  2. Published

    Nanoscale stress and microstructure gradients across a buckled Mo-Cu bilayer: Cu self-annealing triggered by interface delamination

    Lassnig, A., Todt, J., Tkadletz, M., Žák, S., Mitterer, C., Medjahed, A. A., Burghammer, M., Keckes, J., Cordill, M. J. & Meindlhumer, M., 15 Oct 2024, In: Acta Materialia. 2025, 283, 15 p., 120465.

    Research output: Contribution to journalArticleResearchpeer-review

  3. Published
  4. Published

    Multimethod cross-sectional characterization approaching the limits of diamond monophase multilayers

    Meindlhumer, M., Grau, J., Sternschulte, H., Halahovets, Y., Siffalovic, P., Burghammer, M., Steinmüller-Nethl, D. & Keckes, J., 13 May 2024, In: Materials characterization. 2024, 212, 15 p., 113973.

    Research output: Contribution to journalArticleResearchpeer-review

  5. Published

    Toughness enhancement in TiN/Zr0.37Al0.63N1.09 multilayer films

    Lorentzon, M., Meindlhumer, M., Palisaitis, J., Greczynski, G., Keckes, J., Rosen, J., Hultman, L., Birch, J. & Ghafoor, N., 4 May 2024, In: Acta Materialia. 2024, 273, 14 p., 119979.

    Research output: Contribution to journalArticleResearchpeer-review

  6. Published

    Hardness and fracture toughness enhancement in transition metal diboride multilayer films with structural variations

    Vidis, M., Fiantok, T., Gocnik, M., Svec, P. J., Nagy, S., Truchly, M., Izai, V., Roch, T., Satrapinskyy, L., Sroba, V., Meindlhumer, M., Grancic, B., Kus, P., Keckes, J. & Mikula, M., 21 Mar 2024, In: Materialia. 2024, 34, 11 p., 102070.

    Research output: Contribution to journalArticleResearchpeer-review

  7. Published

    Micromechanical Properties of Micro- and Nanocrystalline CVD Diamond Thin Films with Gradient Microstructures and Stresses

    Meindlhumer, M., Ziegelwanger, T., Grau, J., Sternschulte, H., Sztucki, M., Steinmüller-Nethl, D. & Keckes, J., 12 Jan 2024, In: Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films. 2024, 42, 12 p., 023401.

    Research output: Contribution to journalArticleResearchpeer-review

  8. Published
  9. 2023
  10. Published

    Intragranular thermal fatigue of Cu thin films: Near-grain boundary hardening, strain localization and voiding

    Hlushko, K., Ziegelwanger, T., Reisinger, M., Todt, J., Meindlhumer, M., Beuer, S., Rommel, M., Greving, I., Flenner, S., Kopecek, J., Keckes, J., Detlefs, C. & Yildirim, C., 1 Jul 2023, In: Acta Materialia. 253.2023, 1 July, 10 p., 118961.

    Research output: Contribution to journalArticleResearchpeer-review

  11. Published

    Local gradients of microstructure and residual stresses in Si device sidewalls separated by laser dicing

    Ziegelwanger, T., Meindlhumer, M., Todt, J., Reisinger, M., Matoy, K. & Keckes, J., 24 Apr 2023.

    Research output: Contribution to conferencePosterResearch

  12. Published
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