Markus Weber
(Former)
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Research output
- 2020
- Published
Numerical analysis of a MEMS sensor's deformation behavior considering dynamic moisture conditions
Yalagach, M., Fuchs, P. F., Antretter, T., Qi, T. & Weber, M., 2 Dec 2020, 2020 IEEE 22nd Electronics Packaging Technology Conference, EPTC 2020. Institute of Electrical and Electronics Engineers, p. 380-385 6 p. 9315091. (2020 IEEE 22nd Electronics Packaging Technology Conference, EPTC 2020).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- 2005
- Published