Katerina Macurova
(Former)
1 - 7 out of 7Page size: 10
Research output
- 2016
- E-pub ahead of print
Curvature determination of embedded silicon chips by in situ rocking curve X-ray diffraction measurements at elevated temperatures
Angerer, P., Schöngrundner, R., Macurova, K., Wießner, M. & Keckes, J., 28 Sept 2016, (E-pub ahead of print) In: Powder diffraction. 31.2016, 4, p. 267-273 7 p.Research output: Contribution to journal › Article › Research › peer-review
- 2015
- Published
Mechanical testing and fracture analyses of miniaturized ZnO-based multilayer components
Macurova, K., Gruber, M., Pletz, M., Supancic, P., Danzer, R., Aldrian, F. & Bermejo, R., 26 Oct 2015Research output: Other contribution › Research
- Published
Simulation of the packaging process of embedded components in printed circuit boards
Macurova, K., 2015Research output: Thesis › Doctoral Thesis
- Published
Stress and Deflection Development During Die Embedding into Printed Circuit Boards
Macurova, K., Angerer, P., Bermejo, R., Pletz, M., Schöngrundner, R., Antretter, T., Krivec, T., Morianz, M., Brizoux, M. & Lecavelier, A., 2015, In: Materials Today: Proceedings. 2, 2, p. 4196-4205 10 p.Research output: Contribution to journal › Article › Research › peer-review
- 2014
- Published
Comparison of different methods for stress and deflection analysis in embedded die packages during the assembly process
Macurova, K., Bermejo Moratinos, R., Pletz, M., Schöngrundner, R., Antretter, T., Krivec, T., Morianz, M., Brizoux, M. & Lecavelier, A., 1 Jan 2014, Proceedings - 2014 47th International Symposium on Microelectronics, IMAPS 2014. p. 355-360 6 p.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- Published
Simulation of stress distribution in assembled silicon dies and deflection of printed circuit boards
Macurova, K., Angerer, P., Antretter, T., Bermejo Moratinos, R., Maia, W., Schöngrundner, R., Krivec, T., Morianz, M. & Brizoux, M., 2014, Proceedings of the 15th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2014.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- 2013
- Published
Multi-physics simulation of the component attachment within embedding process
Macurova, K., Kharicha, A., Pletz, M., Mataln, M., Bermejo, R., Schongrundner, R., Krivec, T., Antretter, T., Maia, W., Morianz, M. & Brizoux, M., 1 Apr 2013, 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013. Institute of Electrical and Electronics Engineers, p. 1-6 6 p.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
