Imane Souli

(Former)

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Research output

  1. 2021
  2. Published

    Stress engineering to reduce mechanical loading in Cu-based metallizations

    Souli, I., 2021

    Research output: Thesis › Doctoral Thesis

  3. 2019
  4. Published

    Thermal stability of immiscible sputter-deposited Cu-Mo thin films

    Souli, I., Gruber, G., Terziyska, V., Zechner, J. & Mitterer, C., 30 Apr 2019, In: Journal of alloys and compounds. 793.2019, April, p. 208-218 11 p.

    Research output: Contribution to journal › Article › Research › peer-review

  5. 2018
  6. Published

    Microstructure and physical properties of sputter-deposited Cu-Mo thin films

    Souli, I., Terziyska, V., Zechner, J. & Mitterer, C., 2018, In: Thin solid films. p. 301-308

    Research output: Contribution to journal › Article › Research › peer-review

  7. 2017
  8. Published

    Effect of growth conditions on interface stability and thermophysical properties of sputtered Cu films on Si with and without WTi barrier layers

    Souli, I., Terziyska, V., Keckes, J., Robl, W., Zechner, J. & Mitterer, C., 9 Feb 2017, In: Journal of vacuum science & technology / B (JVST). 35.2017, 2, 11 p., 022201.

    Research output: Contribution to journal › Article › Research › peer-review

  9. 2016
  10. Published

    Design of multilayer metallization to reduce mechanical loading: Effect of growth conditions on interface stability and thermo-mechanical properties of sputtered Cu films on Si with and without WTi barrier layers

    Souli, I., Terziyska, V., Keckes, J., Zechner, J. & Mitterer, C., 2016.

    Research output: Contribution to conference › Presentation › Research

  11. 2015
  12. Published

    Effect of growth conditions on stress, texture, roughness and self-annealing behavior of sputter deposited Cu films

    Souli, I. & Mitterer, C., 2015.

    Research output: Contribution to conference › Poster › Research › peer-review

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