Daniel Kiener
Activities
- 2021
Ivana Panžić
Kiener, D. (Host)
1 Jun 2021 → 30 Jul 2021Activity: Hosting a visitor › Hosting an academic visitor
Valeria Lemkova
Kiener, D. (Host)
1 Jun 2021 → 30 Jul 2021Activity: Hosting a visitor › Hosting an academic visitor
Fracture of distinct interfaces: In-situ observations vs. stiffness approaches
Kiener, D. (Invited speaker), Wurmshuber, M. (contributor), Schmuck, K. S. (contributor), Renk, O. (contributor), Issa, I. (contributor), Burtscher, M. (contributor) & Gammer, C. (contributor)
3 Jun 2021Activity: Talk or presentation › Oral presentation
Nanomaterials (Journal)
Kiener, D. (Peer reviewer) & Eckert, J. (Peer reviewer)
Aug 2021Activity: Publication peer-review and editorial work › Editorial activity
The challenge of digital image correlation in continuous micron scale mechanical tensile testing
Alfreider, M. (Speaker), Meindlhumer, M. (contributor), Maier-Kiener, V. (contributor), Hohenwarter, A. (contributor) & Kiener, D. (contributor)
26 Aug 2021Activity: Talk or presentation › Oral presentation
Micromechanical fracture characterization of an intermetallic light-weight TiAl alloy
Burtscher, M. (Speaker), Alfreider, M. (contributor), Wurmshuber, M. (contributor), Schmuck, K. S. (contributor), Clemens, H. (contributor), Mayer, S. (contributor) & Kiener, D. (contributor)
15 Sept 2021Activity: Talk or presentation › Oral presentation
Impact of grain size on the fracture toughness for tungsten-copper nanocomposites
Schmuck, K. S. (Speaker), Alfreider, M. (contributor) & Kiener, D. (contributor)
16 Sept 2021Activity: Talk or presentation › Oral presentation
Linking the ‘hardening by annealing’ phenomenon with grain boundary relaxation in HPT processed tantalum
Alfreider, M. (Speaker), Issa, I. (contributor), Renk, O. (contributor) & Kiener, D. (contributor)
16 Sept 2021Activity: Talk or presentation › Oral presentation
Locally resolved interfacial fracture mechanics in a Si-WTi-Cu multilayer system
Alfreider, M. (Speaker), Bodlos, R. (contributor), Romaner, L. (contributor) & Kiener, D. (contributor)
16 Sept 2021Activity: Talk or presentation › Oral presentation
Combining high strength, ductility and toughness in interface-doped W-Cu nanocomposites
Wurmshuber, M. (Speaker), Schmuck, K. S. (contributor), Doppermann, S. (contributor), Burtscher, M. (contributor), Bodlos, R. (contributor), Romaner, L. (contributor) & Kiener, D. (contributor)
17 Sept 2021Activity: Talk or presentation › Oral presentation
