Christian Schipfer
(Former)
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Research output
- 2021
- Published
Prediction of Curing Induced Residual Stresses in Polymeric Encapsulation Materials for Microelectronics
Schipfer, C., Gschwandl, M., Fuchs, P., Antretter, T., Feuchter, M., Morak, M., Tao, Q. & Schingale, A., 19 Apr 2021, 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021. Institute of Electrical and Electronics Engineers, 9410855. (2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- 2019
- Published
Evaluierung mikromechanischer Methoden hinsichtlich praktischer Anwendbarkeit für faserverstärkte Kunststoffe
Schipfer, C., 2019Research output: Thesis › Master's Thesis
- 2017
- Published
Photo-responsive thiol-ene networks for the design of switchable polymer patterns
Radl, S. V., Schipfer, C., Kaiser, S., Moser, A., Kaynak, B., Kern, W. & Schlögl, S., 31 Jan 2017, In: Polymer Chemistry. 8.2017, 9, p. 1562-1572 11 p.Research output: Contribution to journal › Article › Research › peer-review
