Chair of Mechanical Engineering (140)

Organisational unit: Chair

Research output

  1. Published
  2. Published

    Fatigue test results of surface hardened components to evaluate a two layer approach for strength assessment

    Dobberke, D., Wiebesiek, J., Fröschl, J. & Leitner, M., 1 Jan 2018, In: Procedia Engineering. 213, p. 262-269 8 p.

    Research output: Contribution to journalConference articlepeer-review

  3. Published

    A layer approach to model fatigue strength of surface-hardened components

    Dobberke, D., Wiebesiek, J., Fröschl, J. & Leitner, M., 2017, Proceedings of the Fatigue Design Conference 2017.

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  4. Published

    Ein effizienter Ansatz zur numerischen Analyse von Bauteileigenspannungen durch Randschichthärtung

    Dobberke, D. & Leitner, M., Jan 2018, Numerische Simulation in der Betriebsfestigkeit.

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  5. Published
  6. Published

    Berechnung der Antriebsleistung bei RopeCon-Systemen

    Diethardt, P., Kessler, F. & Stoschka, M., 2004, In: Schüttgut. 10, 4, p. 288-293

    Research output: Contribution to journalArticleResearchpeer-review

  7. Published
  8. Published

    Transverse viscoelastic properties of cellulosic fibers investigated by atomic force microscopy

    Czibula, C., Ganser, C., Teichert, C. & Hirn, U., 2019, Paper Conference and Trade Show, PaperCon 2019. p. 1180-1186 7 p. (Paper Conference and Trade Show, PaperCon 2019; vol. 2).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  9. Published

    Improved nanoindentation methods for polymer based multilayer film cross-sections

    Christoefl, P., Jakes, J. E., Geier, J., Pinter, G., Oreski, G., Stone, D. & Teichert, C., 2023, 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023. Institute of Electrical and Electronics Engineers, (2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  10. Published