Chair of Chemistry of Polymeric Materials (231)
Organisational unit: Chair
81 - 90 out of 1,029Page size: 10
Research output
- Published
Photoreactive thin layers for organic electronics
Track, A., Lex, A., Grießer, T., Koller, G., Pacher, P., Romaner, L., Frank, P., Stettner, J., Winkler, A., Schennach, R., Trimmel, G., Kern, W., Zojer, E. & Ramsey, M. G., 2007.Research output: Contribution to conference › Poster › Research › peer-review
- Published
Influence of test fluids on the permeability of epoxy powder bindered non-crimp fabrics
Tonejc, M., Ebner, C., Fauster, E. & Schledjewski, R., 1 Aug 2019, In: Advanced Manufacturing: Polymer and Composites Science. 5.2019, 3, p. 128-139 12 p.Research output: Contribution to journal › Article › Research › peer-review
- Published
Curing of epoxidized linseed oil: Investigation of the curing reaction with different hardener types
Todorovic, A., Resch-Fauster, K., Mahendran, A. R., Oreski, G. & Kern, W., 4 Nov 2020, In: Journal of Applied Polymer Science. 138.2021, 16, 13 p., 50239.Research output: Contribution to journal › Article › Research › peer-review
- Published
Resin composition suitable for printing and printing methods
Thomas, G. (Inventor), Matthias, E. (Inventor), Delara, G. H. (Inventor) & Andreas, B. O. (Inventor), 29 Jan 2020, IPC No. C09D 11/ 101 A I, Patent No. GB2575793, Priority date 20 Jul 2018, Priority No. GB20180011896Research output: Patent
- Published
Ink Composition, kit, method of manufacturing a deformable conductor utilizing the ink composition, deformable conductor and electronic device comprising the
Thomas, G. (Inventor) & Krzysztof, K. K. (Inventor), 24 Feb 2021, IPC No. H05K 3/ 12 A I, Patent No. GB2586450, Priority date 12 Aug 2019, Priority No. GB20190011512Research output: Patent
- Published
Process simulation for digital light processing (DLP) based 3D printing
Thalhammer, A., Strohmeier, L., Pishvazadeh Moghaddam, H., Wolfberger, A. & Fuchs, P., 2021.Research output: Contribution to conference › Poster › Research
- Published
A black-box optimization strategy for customizable global elastic deformation behavior of unit cell-based tri-anti-chiral metamaterials
Thalhamer, A., Fleisch, M., Schuecker, C., Fuchs, P. F., Schlögl, S. & Berer, M., Dec 2023, In: Advances in Engineering Software. 186.2023, December, 19 p., 103553.Research output: Contribution to journal › Article › Research › peer-review
- Published
Thermomechanical and Electrical Material Characterization for a DLP Printing Process Simulation of Electrically Conductive Parts
Thalhamer, A., Rossegger, E., Hasil, S., Hrbinič, K., Feigl, V., Pfost, M. & Fuchs, P. F., 2023.Research output: Contribution to conference › Poster › Research
- Published
An optimization strategy for customizable global elastic deformation of unit cell-based metamaterials with variable material section discretization
Thalhamer, A., Fleisch, M., Schuecker, C., Fuchs, P. F., Schlögl, S. & Berer, M., 12 Nov 2024, In: Advances in Engineering Software. 199.2025, January, 17 p., 103817.Research output: Contribution to journal › Article › Research › peer-review
- Published
A Simulation-Based Assessment of Print Accuracy for Microelectronic Parts Manufactured with DLP 3D Printing Process
Thalhamer, A., Fuchs, P., Strohmeier, L., Hasil, S. & Wolfberger, A., 2022, 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022. Institute of Electrical and Electronics Engineers, (2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
