TiN diffusion barrier failure by the formation of Cu3Si investigated by electron microscopy and atom probe tomography
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in: Journal of Vacuum Science and Technology B, JVSTB, Jahrgang 34.2016, Nr. 2, 022202, 19.02.2016, S. 1-8.
Publikationen: Beitrag in Fachzeitschrift › Artikel › Forschung › (peer-reviewed)
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TY - JOUR
T1 - TiN diffusion barrier failure by the formation of Cu3Si investigated by electron microscopy and atom probe tomography
AU - Mühlbacher, Marlene
AU - Greczynski, Grzegorz
AU - Sartory, Bernhard
AU - Mendez Martin, Francisca
AU - Schalk, Nina
AU - Lu, Jun
AU - Hultman, Lars
AU - Mitterer, Christian
PY - 2016/2/19
Y1 - 2016/2/19
U2 - 10.1116/1.4942003
DO - 10.1116/1.4942003
M3 - Article
VL - 34.2016
SP - 1
EP - 8
JO - Journal of Vacuum Science and Technology B, JVSTB
JF - Journal of Vacuum Science and Technology B, JVSTB
SN - 2166-2746
IS - 2
M1 - 022202
ER -