Thermal and Moisture Dependent Material Characterization and Modeling of Glass Fibre Reinforced Epoxy Laminates
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in: Sensors & transducers, Jahrgang 248.2021, Nr. 1, 29.01.2021.
Publikationen: Beitrag in Fachzeitschrift › Artikel › Forschung › (peer-reviewed)
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TY - JOUR
T1 - Thermal and Moisture Dependent Material Characterization and Modeling of Glass Fibre Reinforced Epoxy Laminates
AU - Yalagach, Mahesh
AU - Fuchs, Peter
AU - Antretter, Thomas
AU - Feuchter, Michael
AU - Tao, Qi
AU - Weber, Markus
PY - 2021/1/29
Y1 - 2021/1/29
N2 - The Micro-Electro-Mechanical Semiconductor (MEMS) sensor packages are an advanced multimaterial composite system. These packages comprise polymeric materials like prepregs, solder-mask, insulation, and conductive adhesives. Prepregs are glass fiber reinforced epoxy laminates. Only a low material sensitivity to environmental influences will ensure the sensors' reliable performance during their application lifetime. To this end, the potentially applied materials undergo defined thermal and moisture-dependent material characterization. In this contribution, the influence of moisture and temperature has been studied for five different prepreg materials, which are commonly applied as a substrate material in a MEM'S sensor. The measured thermal and moisture dependent material properties are the basis for a numerical diffusion analysis and a virtual hygro-thermomechanical reliability assessment.
AB - The Micro-Electro-Mechanical Semiconductor (MEMS) sensor packages are an advanced multimaterial composite system. These packages comprise polymeric materials like prepregs, solder-mask, insulation, and conductive adhesives. Prepregs are glass fiber reinforced epoxy laminates. Only a low material sensitivity to environmental influences will ensure the sensors' reliable performance during their application lifetime. To this end, the potentially applied materials undergo defined thermal and moisture-dependent material characterization. In this contribution, the influence of moisture and temperature has been studied for five different prepreg materials, which are commonly applied as a substrate material in a MEM'S sensor. The measured thermal and moisture dependent material properties are the basis for a numerical diffusion analysis and a virtual hygro-thermomechanical reliability assessment.
M3 - Artikel
VL - 248.2021
JO - Sensors & transducers
JF - Sensors & transducers
SN - 1726-5489
IS - 1
ER -
