Strength and fracture analysis of silicon chips to be embedded into printed circuit boards

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Strength and fracture analysis of silicon chips to be embedded into printed circuit boards. / Deluca, M.; Bermejo, Raul; Pletz, M. et al.
18th European Conference on Fracture: Fracture of Materials and Structures from Micro to Macro Scale. 2010.

Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband

Harvard

Deluca, M, Bermejo, R, Pletz, M & Supancic, P 2010, Strength and fracture analysis of silicon chips to be embedded into printed circuit boards. in 18th European Conference on Fracture: Fracture of Materials and Structures from Micro to Macro Scale. 18th European Conference on Fracture: Fracture of Materials and Structures from Micro to Macro Scale, ECF 2010, Dresden, Deutschland, 30/08/10.

APA

Deluca, M., Bermejo, R., Pletz, M., & Supancic, P. (2010). Strength and fracture analysis of silicon chips to be embedded into printed circuit boards. In 18th European Conference on Fracture: Fracture of Materials and Structures from Micro to Macro Scale

Vancouver

Deluca M, Bermejo R, Pletz M, Supancic P. Strength and fracture analysis of silicon chips to be embedded into printed circuit boards. in 18th European Conference on Fracture: Fracture of Materials and Structures from Micro to Macro Scale. 2010

Author

Deluca, M. ; Bermejo, Raul ; Pletz, M. et al. / Strength and fracture analysis of silicon chips to be embedded into printed circuit boards. 18th European Conference on Fracture: Fracture of Materials and Structures from Micro to Macro Scale. 2010.

Bibtex - Download

@inproceedings{17f1e41d00044efc860b42a0a585a5bd,
title = "Strength and fracture analysis of silicon chips to be embedded into printed circuit boards",
keywords = "Biaxial strength, Brittle fracture, Failure analysis, Functional applications, PCB, Silicon, Weibull statistics",
author = "M. Deluca and Raul Bermejo and M. Pletz and P. Supancic",
year = "2010",
language = "English",
booktitle = "18th European Conference on Fracture: Fracture of Materials and Structures from Micro to Macro Scale",
note = "18th European Conference on Fracture: Fracture of Materials and Structures from Micro to Macro Scale, ECF 2010 ; Conference date: 30-08-2010 Through 03-09-2010",

}

RIS (suitable for import to EndNote) - Download

TY - GEN

T1 - Strength and fracture analysis of silicon chips to be embedded into printed circuit boards

AU - Deluca, M.

AU - Bermejo, Raul

AU - Pletz, M.

AU - Supancic, P.

PY - 2010

Y1 - 2010

KW - Biaxial strength

KW - Brittle fracture

KW - Failure analysis

KW - Functional applications

KW - PCB

KW - Silicon

KW - Weibull statistics

UR - http://www.scopus.com/inward/record.url?scp=84870972219&partnerID=8YFLogxK

M3 - Conference contribution

AN - SCOPUS:84870972219

BT - 18th European Conference on Fracture: Fracture of Materials and Structures from Micro to Macro Scale

T2 - 18th European Conference on Fracture: Fracture of Materials and Structures from Micro to Macro Scale, ECF 2010

Y2 - 30 August 2010 through 3 September 2010

ER -

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