Resolving the fundamentals of the J-integral concept by multi-method in situ nanoscale stress-strain mapping

Publikationen: Beitrag in FachzeitschriftArtikelForschung(peer-reviewed)

Autoren

Organisationseinheiten

Externe Organisationseinheiten

  • Polytechnic Department of Engineering and Architecture (DPIA), University of Udine, Udine, Italy
  • European Synchrotron Radiation Facility

Abstract

The integrity of structural materials is oftentimes defined by their resistance against catastrophic failure through dissipative plastic processes at the crack tip, commonly quantified by the J-integral concept. However, to date the experimental stress and strain fields necessary to quantify the J-integral associated with local crack propagation in its original integral form were inaccessible. Here, we present a multi-method nanoscale strain- and stress-mapping surrounding a growing crack tip in two identical miniaturized fracture specimens made from a nanocrystalline FeCrMnNiCo high-entropy alloy. The respective samples were tested in situ in a scanning electron microscope and a synchrotron X-ray nanodiffraction setup, with detailed analyzes of loading states during elastic loading, crack tip blunting and general yielding, corroborated by a detailed elastic-plastic finite element model. This complementary in situ methodology uniquely enabled a detailed quantification of the J-integral along different integration paths from experimental nanoscale stress and strain fields. We find that conventional linear-elastic and elastic-plastic models, typically used to interpret fracture phenomena, have limited applicability at micron to nanoscale distances from propagating cracks. This for the first time unravels a limit to the path-independence of the J-integral, which has significant implications in the development and assessment of modern damage-tolerant materials and microstructures.

Details

OriginalspracheEnglisch
Aufsatznummer35
Seitenumfang15
FachzeitschriftCommunications materials
Jahrgang2025
Ausgabenummer6
StatusVeröffentlicht - 22 Feb. 2025