Numerical Study of the Thermal-Solutal Convection and Grain Sedimentation during Globular Equiaxed Solidification
Publikationen: Beitrag in Fachzeitschrift › Artikel › Forschung › (peer-reviewed)
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Numerical Study of the Thermal-Solutal Convection and Grain Sedimentation during Globular Equiaxed Solidification. / Wu, Menghuai; Ludwig, Andreas; Luo, Jian.
in: Materials Science Forum , Jahrgang 475-479, 2005, S. 2725-2730.
in: Materials Science Forum , Jahrgang 475-479, 2005, S. 2725-2730.
Publikationen: Beitrag in Fachzeitschrift › Artikel › Forschung › (peer-reviewed)
Harvard
Wu, M, Ludwig, A & Luo, J 2005, 'Numerical Study of the Thermal-Solutal Convection and Grain Sedimentation during Globular Equiaxed Solidification', Materials Science Forum , Jg. 475-479, S. 2725-2730.
APA
Wu, M., Ludwig, A., & Luo, J. (2005). Numerical Study of the Thermal-Solutal Convection and Grain Sedimentation during Globular Equiaxed Solidification. Materials Science Forum , 475-479, 2725-2730.
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Bibtex - Download
@article{65e2b57c71b9478099cc34b03c985b2e,
title = "Numerical Study of the Thermal-Solutal Convection and Grain Sedimentation during Globular Equiaxed Solidification",
author = "Menghuai Wu and Andreas Ludwig and Jian Luo",
year = "2005",
language = "English",
volume = "475-479",
pages = "2725--2730",
journal = "Materials Science Forum ",
issn = "0255-5476",
publisher = "Trans Tech Publications",
}
RIS (suitable for import to EndNote) - Download
TY - JOUR
T1 - Numerical Study of the Thermal-Solutal Convection and Grain Sedimentation during Globular Equiaxed Solidification
AU - Wu, Menghuai
AU - Ludwig, Andreas
AU - Luo, Jian
PY - 2005
Y1 - 2005
M3 - Article
VL - 475-479
SP - 2725
EP - 2730
JO - Materials Science Forum
JF - Materials Science Forum
SN - 0255-5476
ER -
