Numerical simulation of the electrical performance of printed circuit boards under cyclic thermal loads
Publikationen: Beitrag in Fachzeitschrift › Artikel › Forschung › (peer-reviewed)
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Numerical simulation of the electrical performance of printed circuit boards under cyclic thermal loads. / Fellner, Klaus; Antretter, Thomas; Fuchs, Peter Filipp et al.
in: Microelectronics Reliability, 2016, S. 148-155.
in: Microelectronics Reliability, 2016, S. 148-155.
Publikationen: Beitrag in Fachzeitschrift › Artikel › Forschung › (peer-reviewed)
Harvard
Fellner, K, Antretter, T, Fuchs, PF & Tao, Q 2016, 'Numerical simulation of the electrical performance of printed circuit boards under cyclic thermal loads', Microelectronics Reliability, S. 148-155.
APA
Fellner, K., Antretter, T., Fuchs, P. F., & Tao, Q. (2016). Numerical simulation of the electrical performance of printed circuit boards under cyclic thermal loads. Microelectronics Reliability, 148-155.
Vancouver
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Bibtex - Download
@article{8ae450ab7d3f424ba86b0a7bb25785ba,
title = "Numerical simulation of the electrical performance of printed circuit boards under cyclic thermal loads",
author = "Klaus Fellner and Thomas Antretter and Fuchs, {Peter Filipp} and Qi Tao",
year = "2016",
language = "English",
pages = "148--155",
journal = "Microelectronics Reliability",
issn = "0026-2714",
publisher = "Elsevier",
}
RIS (suitable for import to EndNote) - Download
TY - JOUR
T1 - Numerical simulation of the electrical performance of printed circuit boards under cyclic thermal loads
AU - Fellner, Klaus
AU - Antretter, Thomas
AU - Fuchs, Peter Filipp
AU - Tao, Qi
PY - 2016
Y1 - 2016
M3 - Article
SP - 148
EP - 155
JO - Microelectronics Reliability
JF - Microelectronics Reliability
SN - 0026-2714
ER -
