Multi-physics simulation of the component attachment within embedding process

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Multi-physics simulation of the component attachment within embedding process. / Macurova, Katerina; Kharicha, A.; Pletz, M. et al.
14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013. Institute of Electrical and Electronics Engineers, 2013. S. 1-6.

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Harvard

Macurova, K, Kharicha, A, Pletz, M, Mataln, M, Bermejo, R, Schongrundner, R, Krivec, T, Antretter, T, Maia, W, Morianz, M & Brizoux, M 2013, Multi-physics simulation of the component attachment within embedding process. in 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013. Institute of Electrical and Electronics Engineers, S. 1-6, 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems , Wroclaw, Polen, 15/04/13. https://doi.org/10.1109/EuroSimE.2013.6529914

APA

Macurova, K., Kharicha, A., Pletz, M., Mataln, M., Bermejo, R., Schongrundner, R., Krivec, T., Antretter, T., Maia, W., Morianz, M., & Brizoux, M. (2013). Multi-physics simulation of the component attachment within embedding process. In 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013 (S. 1-6). Institute of Electrical and Electronics Engineers. https://doi.org/10.1109/EuroSimE.2013.6529914

Vancouver

Macurova K, Kharicha A, Pletz M, Mataln M, Bermejo R, Schongrundner R et al. Multi-physics simulation of the component attachment within embedding process. in 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013. Institute of Electrical and Electronics Engineers. 2013. S. 1-6 doi: 10.1109/EuroSimE.2013.6529914

Author

Macurova, Katerina ; Kharicha, A. ; Pletz, M. et al. / Multi-physics simulation of the component attachment within embedding process. 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013. Institute of Electrical and Electronics Engineers, 2013. S. 1-6

Bibtex - Download

@inproceedings{3ede049b8c6847dc9ca99f09b7c35cd6,
title = "Multi-physics simulation of the component attachment within embedding process",
keywords = "adhesives, circuit complexity, formal verification, printed circuits, PCB complexity, adhesive thickness, commercial program Ansys FLUENT, component attachment, embedding process, model validation, multiphysics simulation, numerical model, printed circuit boards complexity, Abstracts, Analytical models, Copper, Differential equations, Numerical models, Reliability",
author = "Katerina Macurova and A. Kharicha and M. Pletz and M. Mataln and Raul Bermejo and R. Schongrundner and T. Krivec and T. Antretter and W. Maia and M. Morianz and M. Brizoux",
year = "2013",
month = apr,
day = "1",
doi = "10.1109/EuroSimE.2013.6529914",
language = "English",
isbn = "978-1-4673-6138-5",
pages = "1--6",
booktitle = "14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013",
publisher = "Institute of Electrical and Electronics Engineers",
address = "United States",
note = "EuroSimE 2013 ; Conference date: 15-04-2013 Through 17-04-2013",

}

RIS (suitable for import to EndNote) - Download

TY - GEN

T1 - Multi-physics simulation of the component attachment within embedding process

AU - Macurova, Katerina

AU - Kharicha, A.

AU - Pletz, M.

AU - Mataln, M.

AU - Bermejo, Raul

AU - Schongrundner, R.

AU - Krivec, T.

AU - Antretter, T.

AU - Maia, W.

AU - Morianz, M.

AU - Brizoux, M.

PY - 2013/4/1

Y1 - 2013/4/1

KW - adhesives

KW - circuit complexity

KW - formal verification

KW - printed circuits

KW - PCB complexity

KW - adhesive thickness

KW - commercial program Ansys FLUENT

KW - component attachment

KW - embedding process

KW - model validation

KW - multiphysics simulation

KW - numerical model

KW - printed circuit boards complexity

KW - Abstracts

KW - Analytical models

KW - Copper

KW - Differential equations

KW - Numerical models

KW - Reliability

U2 - 10.1109/EuroSimE.2013.6529914

DO - 10.1109/EuroSimE.2013.6529914

M3 - Conference contribution

SN - 978-1-4673-6138-5

SP - 1

EP - 6

BT - 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013

PB - Institute of Electrical and Electronics Engineers

T2 - EuroSimE 2013

Y2 - 15 April 2013 through 17 April 2013

ER -

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