Microstructure and physical properties of sputter-deposited Cu-Mo thin films
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Microstructure and physical properties of sputter-deposited Cu-Mo thin films. / Souli, Imane; Terziyska, Velislava; Zechner, Johannes et al.
in: Thin solid films, 2018, S. 301-308.
in: Thin solid films, 2018, S. 301-308.
Publikationen: Beitrag in Fachzeitschrift › Artikel › Forschung › (peer-reviewed)
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Souli I, Terziyska V, Zechner J, Mitterer C. Microstructure and physical properties of sputter-deposited Cu-Mo thin films. Thin solid films. 2018;301-308. doi: 10.1016/j.tsf.2018.03.039
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@article{c4fd7fce85b84f9f90daf3fa552a04ea,
title = "Microstructure and physical properties of sputter-deposited Cu-Mo thin films",
author = "Imane Souli and Velislava Terziyska and Johannes Zechner and Christian Mitterer",
year = "2018",
doi = "10.1016/j.tsf.2018.03.039",
language = "English",
pages = "301--308",
journal = "Thin solid films",
issn = "0040-6090",
publisher = "Elsevier",
}
RIS (suitable for import to EndNote) - Download
TY - JOUR
T1 - Microstructure and physical properties of sputter-deposited Cu-Mo thin films
AU - Souli, Imane
AU - Terziyska, Velislava
AU - Zechner, Johannes
AU - Mitterer, Christian
PY - 2018
Y1 - 2018
U2 - 10.1016/j.tsf.2018.03.039
DO - 10.1016/j.tsf.2018.03.039
M3 - Article
SP - 301
EP - 308
JO - Thin solid films
JF - Thin solid films
SN - 0040-6090
ER -
