Investigation of the thermal expansion behaviour of PV module encapsulation materials
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Investigation of the thermal expansion behaviour of PV module encapsulation materials. / Knausz, Marlene; Oreski, Gernot; Guttmann, Peter.
The Proceedings of the Austrian – Slovenian Polymer Meeting 2013. 2013. S. 44-46.
The Proceedings of the Austrian – Slovenian Polymer Meeting 2013. 2013. S. 44-46.
Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
Harvard
Knausz, M, Oreski, G & Guttmann, P 2013, Investigation of the thermal expansion behaviour of PV module encapsulation materials. in The Proceedings of the Austrian – Slovenian Polymer Meeting 2013. S. 44-46.
APA
Knausz, M., Oreski, G., & Guttmann, P. (2013). Investigation of the thermal expansion behaviour of PV module encapsulation materials. In The Proceedings of the Austrian – Slovenian Polymer Meeting 2013 (S. 44-46)
Vancouver
Knausz M, Oreski G, Guttmann P. Investigation of the thermal expansion behaviour of PV module encapsulation materials. in The Proceedings of the Austrian – Slovenian Polymer Meeting 2013. 2013. S. 44-46
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Bibtex - Download
@inproceedings{a4f172c476f44703993788981147c32c,
title = "Investigation of the thermal expansion behaviour of PV module encapsulation materials",
author = "Marlene Knausz and Gernot Oreski and Peter Guttmann",
year = "2013",
language = "English",
pages = "44--46",
booktitle = "The Proceedings of the Austrian – Slovenian Polymer Meeting 2013",
}
RIS (suitable for import to EndNote) - Download
TY - GEN
T1 - Investigation of the thermal expansion behaviour of PV module encapsulation materials
AU - Knausz, Marlene
AU - Oreski, Gernot
AU - Guttmann, Peter
PY - 2013
Y1 - 2013
M3 - Conference contribution
SP - 44
EP - 46
BT - The Proceedings of the Austrian – Slovenian Polymer Meeting 2013
ER -
