TY - GEN

T1 - Investigating mechanical properties of silicon carbide coated carbon nanotube composite at elevated temperatures

AU - Mo, Jiarui

AU - Schaffar, Gerald J.K.

AU - Du, Leiming

AU - Maier-Kiener, Verena

AU - Kiener, Daniel

AU - Vollebregt, Sten

AU - Zhang, Guoqi

N1 - Publisher Copyright: © 2024 IEEE.

PY - 2024

Y1 - 2024

N2 - Silicon carbide (SiC) coated vertically aligned carbon nanotubes (VACNT) are attractive material for fabricating MEMS devices as an alternative for bulk micromachining of SiC. In order to examine the mechanical properties of SiC-CNT composites at high temperatures, we fabricated VACNT micro-pillars with different amounts of SiC coating and performed high-temperature micro-pillar compression on these samples. The indentation result shows that the coating can improve the elastic modulus up to three orders of magnitude. Samples were tested at room temperature, 300°C, 600°C, and 900°C under compressive load. No significant degradation of the mechanical properties was observed at elevated temperatures, demonstrating the harsh environment potential of this composite.

AB - Silicon carbide (SiC) coated vertically aligned carbon nanotubes (VACNT) are attractive material for fabricating MEMS devices as an alternative for bulk micromachining of SiC. In order to examine the mechanical properties of SiC-CNT composites at high temperatures, we fabricated VACNT micro-pillars with different amounts of SiC coating and performed high-temperature micro-pillar compression on these samples. The indentation result shows that the coating can improve the elastic modulus up to three orders of magnitude. Samples were tested at room temperature, 300°C, 600°C, and 900°C under compressive load. No significant degradation of the mechanical properties was observed at elevated temperatures, demonstrating the harsh environment potential of this composite.

KW - compression test

KW - high-temperature

KW - micro-pillar

KW - SiC-CNT composite

UR - http://www.scopus.com/inward/record.url?scp=85186734913&partnerID=8YFLogxK

U2 - 10.1109/MEMS58180.2024.10439455

DO - 10.1109/MEMS58180.2024.10439455

M3 - Conference contribution

VL - 37.2024

T3 - IEEE access

SP - 626

EP - 629

BT - 2024 IEEE 37th International Conference on Micro Electro Mechanical Systems (MEMS)

ER -