Interface mediated deformation and fracture of an elastic–plastic bimaterial system resolved by in situ transmission scanning electron microscopy
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in: Materials and Design, Jahrgang 223.2022, Nr. November, 111136, 14.09.2022.
Publikationen: Beitrag in Fachzeitschrift › Artikel › Forschung › (peer-reviewed)
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TY - JOUR
T1 - Interface mediated deformation and fracture of an elastic–plastic bimaterial system resolved by in situ transmission scanning electron microscopy
AU - Alfreider, Markus
AU - Balbus, Glenn
AU - Wang, Fulin
AU - Zechner, Johannes
AU - Gianola, Daniel S.
AU - Kiener, Daniel
N1 - Publisher Copyright: © 2022 The Authors
PY - 2022/9/14
Y1 - 2022/9/14
N2 - A wide variety of today’s engineering material systems consist of multiple layered constituents to satisfy varying demands, e.g. thermal barrier- or hard coatings, thermal- or electrical conduction or insulation layers, or diffusion barriers. However, these layers are commonly only of the order of a few hundred nanometers to microns thick, which renders conventional mechanical investigation of interfacial failure quite challenging, especially if plastically deforming constituents are involved. Herein, we present an in situ study of the mechanical deformation of a WTi-Cu model interface, commonly encountered in the microelectronics industry, utilizing transmission scanning electron microscopy. This approach elucidated the interplay between plastic deformation and fracture processes when loading either perpendicular (mode I) or parallel to the interface (mode II). Under mode I purely ductile failure in the Cu phase, exhibiting dislocation slip facilitated void nucleation and coalescence, was observed with an initiation value for dislocation propagation of Jdislocation≈15 J/m2. Mode II loading exhibited nucleation and propagation of an interface crack, with the initiation value for crack extension as Jcrack≈8.8 J/m2. The results are discussed with respect to the frameworks of classical fracture mechanics and dislocation plasticity, providing fundamental insight into the failure behaviour of elastic–plastic interfaces with respect to loading orientation.
AB - A wide variety of today’s engineering material systems consist of multiple layered constituents to satisfy varying demands, e.g. thermal barrier- or hard coatings, thermal- or electrical conduction or insulation layers, or diffusion barriers. However, these layers are commonly only of the order of a few hundred nanometers to microns thick, which renders conventional mechanical investigation of interfacial failure quite challenging, especially if plastically deforming constituents are involved. Herein, we present an in situ study of the mechanical deformation of a WTi-Cu model interface, commonly encountered in the microelectronics industry, utilizing transmission scanning electron microscopy. This approach elucidated the interplay between plastic deformation and fracture processes when loading either perpendicular (mode I) or parallel to the interface (mode II). Under mode I purely ductile failure in the Cu phase, exhibiting dislocation slip facilitated void nucleation and coalescence, was observed with an initiation value for dislocation propagation of Jdislocation≈15 J/m2. Mode II loading exhibited nucleation and propagation of an interface crack, with the initiation value for crack extension as Jcrack≈8.8 J/m2. The results are discussed with respect to the frameworks of classical fracture mechanics and dislocation plasticity, providing fundamental insight into the failure behaviour of elastic–plastic interfaces with respect to loading orientation.
KW - Crack extension
KW - Interface toughness
KW - Mode mixity
KW - Thin films
KW - TSEM
UR - http://www.scopus.com/inward/record.url?scp=85138455992&partnerID=8YFLogxK
U2 - 10.1016/j.matdes.2022.111136
DO - 10.1016/j.matdes.2022.111136
M3 - Article
AN - SCOPUS:85138455992
VL - 223.2022
JO - Materials and Design
JF - Materials and Design
SN - 0264-1275
IS - November
M1 - 111136
ER -