Integrated experimental and computational approach for residual stress investigation near through-silicon vias
Publikationen: Beitrag in Fachzeitschrift › Artikel › Forschung › (peer-reviewed)
Standard
Integrated experimental and computational approach for residual stress investigation near through-silicon vias. / Deluca, Marco; Hammer, R.; Keckes, Jozef et al.
in: Journal of applied physics, Jahrgang 120, Nr. 19, 2016.
in: Journal of applied physics, Jahrgang 120, Nr. 19, 2016.
Publikationen: Beitrag in Fachzeitschrift › Artikel › Forschung › (peer-reviewed)
Harvard
Deluca, M, Hammer, R, Keckes, J, Kraft, J, Schrank, F, Todt, J, Robach, O, Micha, JS & Defregger, S 2016, 'Integrated experimental and computational approach for residual stress investigation near through-silicon vias', Journal of applied physics, Jg. 120, Nr. 19. https://doi.org/10.1063/1.4967927
APA
Deluca, M., Hammer, R., Keckes, J., Kraft, J., Schrank, F., Todt, J., Robach, O., Micha, J. S., & Defregger, S. (2016). Integrated experimental and computational approach for residual stress investigation near through-silicon vias. Journal of applied physics, 120(19). https://doi.org/10.1063/1.4967927
Vancouver
Deluca M, Hammer R, Keckes J, Kraft J, Schrank F, Todt J et al. Integrated experimental and computational approach for residual stress investigation near through-silicon vias. Journal of applied physics. 2016;120(19). doi: http://dx.doi.org/10.1063/1.4967927
Author
Bibtex - Download
@article{a3244f40f7c14d2e90ed881c3b8b0a6c,
title = "Integrated experimental and computational approach for residual stress investigation near through-silicon vias",
author = "Marco Deluca and R. Hammer and Jozef Keckes and J. Kraft and F. Schrank and Juraj Todt and O. Robach and Micha, {J. S.} and Stefan Defregger",
year = "2016",
doi = "http://dx.doi.org/10.1063/1.4967927",
language = "Undefined/Unknown",
volume = "120",
journal = "Journal of applied physics",
issn = "0021-8979",
publisher = "American Institute of Physics Publising LLC",
number = "19",
}
RIS (suitable for import to EndNote) - Download
TY - JOUR
T1 - Integrated experimental and computational approach for residual stress investigation near through-silicon vias
AU - Deluca, Marco
AU - Hammer, R.
AU - Keckes, Jozef
AU - Kraft, J.
AU - Schrank, F.
AU - Todt, Juraj
AU - Robach, O.
AU - Micha, J. S.
AU - Defregger, Stefan
PY - 2016
Y1 - 2016
U2 - http://dx.doi.org/10.1063/1.4967927
DO - http://dx.doi.org/10.1063/1.4967927
M3 - Article
VL - 120
JO - Journal of applied physics
JF - Journal of applied physics
SN - 0021-8979
IS - 19
ER -
