Improved nanoindentation methods for polymer based multilayer film cross-sections

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Improved nanoindentation methods for polymer based multilayer film cross-sections. / Christoefl, P.; Jakes, J. E.; Geier, J. et al.
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023. Institute of Electrical and Electronics Engineers, 2023. (2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023).

Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband

Harvard

Christoefl, P, Jakes, JE, Geier, J, Pinter, G, Oreski, G, Stone, D & Teichert, C 2023, Improved nanoindentation methods for polymer based multilayer film cross-sections. in 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023. 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023, Institute of Electrical and Electronics Engineers, 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023, Graz, Österreich, 16/04/23. https://doi.org/10.1109/EuroSimE56861.2023.10100815

APA

Christoefl, P., Jakes, J. E., Geier, J., Pinter, G., Oreski, G., Stone, D., & Teichert, C. (2023). Improved nanoindentation methods for polymer based multilayer film cross-sections. In 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023 (2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023). Institute of Electrical and Electronics Engineers. https://doi.org/10.1109/EuroSimE56861.2023.10100815

Vancouver

Christoefl P, Jakes JE, Geier J, Pinter G, Oreski G, Stone D et al. Improved nanoindentation methods for polymer based multilayer film cross-sections. in 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023. Institute of Electrical and Electronics Engineers. 2023. (2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023). doi: 10.1109/EuroSimE56861.2023.10100815

Author

Christoefl, P. ; Jakes, J. E. ; Geier, J. et al. / Improved nanoindentation methods for polymer based multilayer film cross-sections. 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023. Institute of Electrical and Electronics Engineers, 2023. (2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023).

Bibtex - Download

@inproceedings{ba6356830e1545bb81e2b0ca41b1aa57,
title = "Improved nanoindentation methods for polymer based multilayer film cross-sections",
author = "P. Christoefl and Jakes, {J. E.} and J. Geier and G. Pinter and G. Oreski and D. Stone and C. Teichert",
note = "Publisher Copyright: {\textcopyright} 2023 IEEE.; 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023 ; Conference date: 16-04-2023 Through 19-04-2023",
year = "2023",
doi = "10.1109/EuroSimE56861.2023.10100815",
language = "English",
series = "2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023",
publisher = "Institute of Electrical and Electronics Engineers",
booktitle = "2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023",
address = "United States",

}

RIS (suitable for import to EndNote) - Download

TY - GEN

T1 - Improved nanoindentation methods for polymer based multilayer film cross-sections

AU - Christoefl, P.

AU - Jakes, J. E.

AU - Geier, J.

AU - Pinter, G.

AU - Oreski, G.

AU - Stone, D.

AU - Teichert, C.

N1 - Publisher Copyright: © 2023 IEEE.

PY - 2023

Y1 - 2023

UR - http://www.scopus.com/inward/record.url?scp=85158145947&partnerID=8YFLogxK

U2 - 10.1109/EuroSimE56861.2023.10100815

DO - 10.1109/EuroSimE56861.2023.10100815

M3 - Conference contribution

AN - SCOPUS:85158145947

T3 - 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023

BT - 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023

PB - Institute of Electrical and Electronics Engineers

T2 - 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023

Y2 - 16 April 2023 through 19 April 2023

ER -

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