Grain boundary design of thin films: Using tilted brittle interfaces for multiple crack deflection toughening
Publikationen: Beitrag in Fachzeitschrift › Artikel › Forschung › (peer-reviewed)
Standard
in: Acta materialia, Jahrgang 122.2017, Nr. 1 January, 02.10.2016, S. 130-137.
Publikationen: Beitrag in Fachzeitschrift › Artikel › Forschung › (peer-reviewed)
Harvard
APA
Vancouver
Author
Bibtex - Download
}
RIS (suitable for import to EndNote) - Download
TY - JOUR
T1 - Grain boundary design of thin films: Using tilted brittle interfaces for multiple crack deflection toughening
AU - Daniel, Rostislav
AU - Meindlhumer, Michael
AU - Baumegger, Walter
AU - Zalesak, Jakub
AU - Sartory, Bernhard
AU - Burghammer, Manfred C.
AU - Mitterer, Christian
AU - Keckes, Jozef
PY - 2016/10/2
Y1 - 2016/10/2
KW - Nanostructured hierarchical materials
KW - Microstructure design
KW - Enhanced fracture toughness
KW - Micromechanical testing
U2 - 10.1016/j.actamat.2016.09.027
DO - 10.1016/j.actamat.2016.09.027
M3 - Article
VL - 122.2017
SP - 130
EP - 137
JO - Acta materialia
JF - Acta materialia
SN - 1359-6454
IS - 1 January
ER -