Electro-Thermo-Mechanical Reliability Assessment of Arbitrary Power Electronics

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Electro-Thermo-Mechanical Reliability Assessment of Arbitrary Power Electronics. / Gschwandl, Mario; Pfost, Martin; Antretter, Thomas et al.
2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021. Institute of Electrical and Electronics Engineers, 2021. 9410862 (2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021).

Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband

Harvard

Gschwandl, M, Pfost, M, Antretter, T, Fuchs, PF, Mitev, I, Tao, Q & Schingale, A 2021, Electro-Thermo-Mechanical Reliability Assessment of Arbitrary Power Electronics. in 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021., 9410862, 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021, Institute of Electrical and Electronics Engineers, 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021, St. Julian, Malta, 19/04/21. https://doi.org/10.1109/EuroSimE52062.2021.9410862

APA

Gschwandl, M., Pfost, M., Antretter, T., Fuchs, P. F., Mitev, I., Tao, Q., & Schingale, A. (2021). Electro-Thermo-Mechanical Reliability Assessment of Arbitrary Power Electronics. In 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021 Artikel 9410862 (2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021). Institute of Electrical and Electronics Engineers. https://doi.org/10.1109/EuroSimE52062.2021.9410862

Vancouver

Gschwandl M, Pfost M, Antretter T, Fuchs PF, Mitev I, Tao Q et al. Electro-Thermo-Mechanical Reliability Assessment of Arbitrary Power Electronics. in 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021. Institute of Electrical and Electronics Engineers. 2021. 9410862. (2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021). doi: 10.1109/EuroSimE52062.2021.9410862

Author

Gschwandl, Mario ; Pfost, Martin ; Antretter, Thomas et al. / Electro-Thermo-Mechanical Reliability Assessment of Arbitrary Power Electronics. 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021. Institute of Electrical and Electronics Engineers, 2021. (2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021).

Bibtex - Download

@inproceedings{8a86383f88f24fa98cbc8967bb37eeec,
title = "Electro-Thermo-Mechanical Reliability Assessment of Arbitrary Power Electronics",
author = "Mario Gschwandl and Martin Pfost and Thomas Antretter and Fuchs, {Peter Filipp} and Ivaylo Mitev and Qi Tao and Angelika Schingale",
note = "Publisher Copyright: {\textcopyright} 2021 IEEE.; 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021 ; Conference date: 19-04-2021 Through 21-04-2021",
year = "2021",
month = apr,
day = "19",
doi = "10.1109/EuroSimE52062.2021.9410862",
language = "English",
series = "2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021",
publisher = "Institute of Electrical and Electronics Engineers",
booktitle = "2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021",
address = "United States",

}

RIS (suitable for import to EndNote) - Download

TY - GEN

T1 - Electro-Thermo-Mechanical Reliability Assessment of Arbitrary Power Electronics

AU - Gschwandl, Mario

AU - Pfost, Martin

AU - Antretter, Thomas

AU - Fuchs, Peter Filipp

AU - Mitev, Ivaylo

AU - Tao, Qi

AU - Schingale, Angelika

N1 - Publisher Copyright: © 2021 IEEE.

PY - 2021/4/19

Y1 - 2021/4/19

UR - http://www.scopus.com/inward/record.url?scp=85105606837&partnerID=8YFLogxK

U2 - 10.1109/EuroSimE52062.2021.9410862

DO - 10.1109/EuroSimE52062.2021.9410862

M3 - Conference contribution

AN - SCOPUS:85105606837

T3 - 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021

BT - 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021

PB - Institute of Electrical and Electronics Engineers

T2 - 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021

Y2 - 19 April 2021 through 21 April 2021

ER -

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