Effect of growth conditions on interface stability and thermophysical properties of sputtered Cu films on Si with and without WTi barrier layers
Publikationen: Beitrag in Fachzeitschrift › Artikel › Forschung › (peer-reviewed)
Standard
Effect of growth conditions on interface stability and thermophysical properties of sputtered Cu films on Si with and without WTi barrier layers. / Souli, Imane; Terziyska, Velislava; Keckes, Jozef et al.
in: Journal of vacuum science & technology / B (JVST), Jahrgang 35.2017, Nr. 2, 022201, 09.02.2017.
in: Journal of vacuum science & technology / B (JVST), Jahrgang 35.2017, Nr. 2, 022201, 09.02.2017.
Publikationen: Beitrag in Fachzeitschrift › Artikel › Forschung › (peer-reviewed)
Harvard
Souli, I, Terziyska, V, Keckes, J, Robl, W, Zechner, J & Mitterer, C 2017, 'Effect of growth conditions on interface stability and thermophysical properties of sputtered Cu films on Si with and without WTi barrier layers', Journal of vacuum science & technology / B (JVST), Jg. 35.2017, Nr. 2, 022201. https://doi.org/10.1116/1.4975805
APA
Souli, I., Terziyska, V., Keckes, J., Robl, W., Zechner, J., & Mitterer, C. (2017). Effect of growth conditions on interface stability and thermophysical properties of sputtered Cu films on Si with and without WTi barrier layers. Journal of vacuum science & technology / B (JVST), 35.2017(2), Artikel 022201. https://doi.org/10.1116/1.4975805
Vancouver
Souli I, Terziyska V, Keckes J, Robl W, Zechner J, Mitterer C. Effect of growth conditions on interface stability and thermophysical properties of sputtered Cu films on Si with and without WTi barrier layers. Journal of vacuum science & technology / B (JVST). 2017 Feb 9;35.2017(2):022201. doi: 10.1116/1.4975805
Author
Bibtex - Download
@article{4d888197264c4fe899b2576e0c8a95a3,
title = "Effect of growth conditions on interface stability and thermophysical properties of sputtered Cu films on Si with and without WTi barrier layers",
author = "Imane Souli and Velislava Terziyska and Jozef Keckes and Werner Robl and Johannes Zechner and Christian Mitterer",
year = "2017",
month = feb,
day = "9",
doi = "10.1116/1.4975805",
language = "English",
volume = "35.2017",
journal = "Journal of vacuum science & technology / B (JVST)",
issn = "1071-1023",
publisher = "AVS Science and Technology Society",
number = "2",
}
RIS (suitable for import to EndNote) - Download
TY - JOUR
T1 - Effect of growth conditions on interface stability and thermophysical properties of sputtered Cu films on Si with and without WTi barrier layers
AU - Souli, Imane
AU - Terziyska, Velislava
AU - Keckes, Jozef
AU - Robl, Werner
AU - Zechner, Johannes
AU - Mitterer, Christian
PY - 2017/2/9
Y1 - 2017/2/9
U2 - 10.1116/1.4975805
DO - 10.1116/1.4975805
M3 - Article
VL - 35.2017
JO - Journal of vacuum science & technology / B (JVST)
JF - Journal of vacuum science & technology / B (JVST)
SN - 1071-1023
IS - 2
M1 - 022201
ER -
