Comparison of different methods for stress and deflection analysis in embedded die packages during the assembly process
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Proceedings - 2014 47th International Symposium on Microelectronics, IMAPS 2014. 2014. S. 355-360.
Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
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TY - GEN
T1 - Comparison of different methods for stress and deflection analysis in embedded die packages during the assembly process
AU - Macurova, K.
AU - Bermejo Moratinos, Raul
AU - Pletz, M.
AU - Schöngrundner, R.
AU - Antretter, T.
AU - Krivec, T.
AU - Morianz, M.
AU - Brizoux, M.
AU - Lecavelier, A.
PY - 2014/1/1
Y1 - 2014/1/1
KW - Assembly process
KW - Classical laminate theory
KW - Fea
KW - Interfacial model
KW - Residual stress
KW - Warpage
UR - http://www.scopus.com/inward/record.url?scp=84925451697&partnerID=8YFLogxK
M3 - Conference contribution
AN - SCOPUS:84925451697
SN - 9780990902805
SP - 355
EP - 360
BT - Proceedings - 2014 47th International Symposium on Microelectronics, IMAPS 2014
T2 - 47th International Symposium on Microelectronics: Future of Packaging, IMAPS 2014
Y2 - 13 October 2014 through 16 October 2014
ER -
