Characterization of the damping behavior of thin films with dynamic mechanic analysis in bending mode
Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
Standard
Characterization of the damping behavior of thin films with dynamic mechanic analysis in bending mode. / Knapp, Gilbert; Leyrer, M; Oreski, Gernot et al.
ASME 2014 International Mechanical Engineering Congress & Exposition . 2014. S. 1-7.
ASME 2014 International Mechanical Engineering Congress & Exposition . 2014. S. 1-7.
Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
Harvard
Knapp, G, Leyrer, M, Oreski, G & Pinter, G 2014, Characterization of the damping behavior of thin films with dynamic mechanic analysis in bending mode. in ASME 2014 International Mechanical Engineering Congress & Exposition
. S. 1-7.
APA
Knapp, G., Leyrer, M., Oreski, G., & Pinter, G. (2014). Characterization of the damping behavior of thin films with dynamic mechanic analysis in bending mode. In ASME 2014 International Mechanical Engineering Congress & Exposition
(S. 1-7)
Vancouver
Knapp G, Leyrer M, Oreski G, Pinter G. Characterization of the damping behavior of thin films with dynamic mechanic analysis in bending mode. in ASME 2014 International Mechanical Engineering Congress & Exposition
. 2014. S. 1-7
Author
Bibtex - Download
@inproceedings{78ba4a9db269465c846c592e27a0f35f,
title = "Characterization of the damping behavior of thin films with dynamic mechanic analysis in bending mode",
author = "Gilbert Knapp and M Leyrer and Gernot Oreski and Gerald Pinter",
year = "2014",
language = "English",
pages = "1--7",
booktitle = "ASME 2014 International Mechanical Engineering Congress & Exposition",
}
RIS (suitable for import to EndNote) - Download
TY - GEN
T1 - Characterization of the damping behavior of thin films with dynamic mechanic analysis in bending mode
AU - Knapp, Gilbert
AU - Leyrer, M
AU - Oreski, Gernot
AU - Pinter, Gerald
PY - 2014
Y1 - 2014
M3 - Conference contribution
SP - 1
EP - 7
BT - ASME 2014 International Mechanical Engineering Congress & Exposition
ER -