Characterization and modeling of the AuSnCu thin solder joint under thermal cycling
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Characterization and modeling of the AuSnCu thin solder joint under thermal cycling. / Antretter, Thomas; Otremba, Ralf; Karunamurthy, Balamurugan et al.
Proceedings of the 15th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2014. 2014.
Proceedings of the 15th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2014. 2014.
Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
Harvard
Antretter, T, Otremba, R, Karunamurthy, B & Pélisset, T 2014, Characterization and modeling of the AuSnCu thin solder joint under thermal cycling. in Proceedings of the 15th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2014.
APA
Antretter, T., Otremba, R., Karunamurthy, B., & Pélisset, T. (2014). Characterization and modeling of the AuSnCu thin solder joint under thermal cycling. In Proceedings of the 15th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2014
Vancouver
Antretter T, Otremba R, Karunamurthy B, Pélisset T. Characterization and modeling of the AuSnCu thin solder joint under thermal cycling. in Proceedings of the 15th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2014. 2014
Author
Bibtex - Download
@inproceedings{ff2394b8a515435c8acf5aa7bbb36253,
title = "Characterization and modeling of the AuSnCu thin solder joint under thermal cycling",
author = "Thomas Antretter and Ralf Otremba and Balamurugan Karunamurthy and Tiphaine P{\'e}lisset",
year = "2014",
language = "English",
isbn = "978-1-4799-4791-1",
booktitle = "Proceedings of the 15th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2014",
}
RIS (suitable for import to EndNote) - Download
TY - GEN
T1 - Characterization and modeling of the AuSnCu thin solder joint under thermal cycling
AU - Antretter, Thomas
AU - Otremba, Ralf
AU - Karunamurthy, Balamurugan
AU - Pélisset, Tiphaine
PY - 2014
Y1 - 2014
M3 - Conference contribution
SN - 978-1-4799-4791-1
BT - Proceedings of the 15th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2014
ER -
