Can micro-compression testing provide stress-strain data for thin films? A comparative study using Cu, VN, TiN and W coatings
Publikationen: Beitrag in Fachzeitschrift › Artikel › Forschung › (peer-reviewed)
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in: Thin solid films, Jahrgang 518, 2009, S. 1517-1521.
Publikationen: Beitrag in Fachzeitschrift › Artikel › Forschung › (peer-reviewed)
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TY - JOUR
T1 - Can micro-compression testing provide stress-strain data for thin films? A comparative study using Cu, VN, TiN and W coatings
AU - Dehm, Gerhard
AU - Wörgötter, Hans-Peter
AU - Cazottes, Sophie
AU - Purswani, Jaya M.
AU - Gall, Daniel
AU - Mitterer, Christian
AU - Kiener, Daniel
PY - 2009
Y1 - 2009
U2 - 10.1016/j.tsf.2009.09.070
DO - 10.1016/j.tsf.2009.09.070
M3 - Article
VL - 518
SP - 1517
EP - 1521
JO - Thin solid films
JF - Thin solid films
SN - 0040-6090
ER -